As the 2024 TechCrunch Disrupt Startup Battlefield runner-up, geCKo Materials left a lasting impression on this year’s TechCrunch Disrupt show. Their creative solutions wowed attendees with these four inventive devices that made all the jurors take notice. The company is a leader in advanced dry adhesive technology. It has developed its product technology that deep, and it’s commercialized enough to support high-precision applications from space missions to semiconductor wafer handling.
GeCKo Materials has developed a new, patented dry adhesive that sets new benchmarks for high strength-to-weight ratio and adaptability. Over the last year, this adhesive has been used successfully in six space missions. Its inherent precision lends itself to operating across all environments, even in a vacuum, meaning this technology can be utilized across all industries and use cases. It takes only a one-inch square of their adhesive to bear the weight of an astounding 16 pounds. Incredibly, it can stick on and pull off an impressive 120,000 times! The bond holds for different lengths of time, from a few seconds to several years, based on the application needs.
Through her presentation at the showcase event, intelligence CEO Dr Capella Kerst was able to illustrate the commercial success that geCKo Materials’ technology has achieved. These products are one of several important parts in essential tools. They’re utilized in semiconductor wafer handling systems and robotic grippers that are purpose-built for handling smooth surfaces such as solar panels and glass. The all-electric company has created a curved robotic “end effector” that flexibly conforms to a different shape with each pass. They developed a versatile all-purpose gripper specifically intended for robotic arms.
Dr. Kerst shared insights into the company’s rapid growth since last year’s TechCrunch Disrupt, stating, “Has this year flown by as quickly for anybody else as it has for us?” She pointed to the growing demand for their technology from marquee customers like TSMC, Samsung, Intel and Kawasaki.
“Our customers at TSMC, Samsung, Intel, and Kawasaki said we have a goal to [move the wafers] at 2Gs of acceleration,” – Dr. Capella Kerst
GeCKo Materials has continued their remarkable product progression. They’ve grown their workforce, tripling their team size since last year’s show. The capital-intensive nature of its business and continued commitment to innovation drove the company’s recent completion of an $8 million funding round.
The launch of these new products at TechCrunch Disrupt is a huge opportunity for geCKo Materials. This annual event celebrates the company’s recent initiatives to cement their place as an industry leader in adhesive technology. With its commitment to develop high-performance solutions for demanding, mission-critical applications, the company looks for success in the decades ahead in numerous markets.
